Empowering the Computing Revolution: Precision Hardware Solutions for AI Infrastructure
Solving the extreme thermal and high-density packaging challenges of the computing era. Through one-stop integrated wire forming, stamping, springs, and precision welding, we provide a rock-solid hardware foundation for AI servers and data centers.
Industry Overview
Driven by LLMs and generative AI, GPU power consumption now exceeds 1000W, creating extreme thermal and mechanical challenges in ultra-dense systems. Engineers must manage heat, ensure cooling reliability, and avoid tolerance issues from multi-vendor parts.
Hershey Spring focuses on the micro-mechanics of AI hardware, delivering integrated sub-assemblies through in-house capabilities—Stamping, Wire Forming, Spring Coiling, and Welding. Our solutions are designed for high creep resistance, precision fit, and 24/7 stability, eliminating throttling and downtime.
For both GPU thermal management and high-speed optical modules (800G / 1.6T), we provide fully integrated solutions—from welded spring-loaded assemblies with zero downforce loss over 5–10 years, to conductive micro-springs (canted coil or toroidal) enabling 360° EMI shielding and stable RF grounding in ultra-compact spaces—ensuring long-term reliability and consistent performance under continuous operation.
Solutions & Customization Capabilities in AI
HERSHEY combines AI-driven technologies with precision spring manufacturing to deliver smarter, faster, and more reliable solutions. From intelligent design optimization to predictive performance analysis and automated production, our integrated approach enhances efficiency, ensures consistent quality, and accelerates development for demanding applications.
Industry-Grade Materials
- High Conductivity & EMI Shielding
Beryllium Copper (C17200): The preferred material for EMI/RFI shielding fingers in high-density server chassis, offering excellent conductivity and superior elasticity.
- High-Temperature & Creep Resistance
High-Yield Stainless Steel (301/304): Used for GPU heat sink mounting brackets, maintaining stable clamping force under continuous 80–100°C operation and preventing stress relaxation.
- Corrosion Resistance for Liquid Cooling
316L Stainless Steel: Designed for pipe clamps and sealing springs in liquid-cooled AI servers, providing strong resistance to coolant corrosion.
Mechanical/Functional Customization Options
- GPU Heat Sink Bracket Assemblies
One-stop integrated solutions combining stamped bases, compression springs, and riveted or welded studs, delivered ready for direct heat sink mounting.
- EMI/RFI Grounding Contacts
Custom-designed complex 3D grounding contacts for effective electromagnetic shielding in server drawers, HDD trays, and cabinet enclosures.
- Blind-Mate Guide Clips
Designed for high-density blade servers, ensuring smooth insertion/removal and secure mechanical locking for hot-swappable modules.
Durability & Reliability Enhancements
- Hot Pre-setting
Eliminates initial deformation of spring-loaded brackets, ensuring constant downforce on chips over a 5–10 year lifecycle, preventing thermal throttling.
- NDT & 100% Inspection
Utilizing CCD-based full inspection, all contact components are verified to be free of deformation and burrs, preventing damage to sensitive AI chip packages and gold fingers.
Industry-Focused Processes
- Ultra-Cleanliness Control
Dust-Free Ultrasonic Cleaning: Thoroughly removes machining oils and micro-metal debris, preventing conductive particles from causing short circuits on sensitive server motherboards.
- Precision Stamping & Forming
Using high-speed progressive dies, we manufacture ultra-thin components down to 0.05mm thickness with micron-level tolerances, ideal for space-constrained 1U/2U servers.
Qualification Certification Obtained
FAQ
Absolutely not. We know “stress relaxation” causes poor heat sink contact and chip overheating. We use high-yield materials (like full-hard SUS301) combined with Hot Pre-setting. This locks the material lattice, ensuring zero downforce attenuation even when operating continuously at 100°C+.
Yes, this is our core strength. Our precision stamping workshop specializes in Beryllium Copper grounding and shielding fingers. We can stamp materials down to 0.05mm thick. Combined with vacuum heat treatment and selective gold plating, we provide excellent conductivity and high mating-cycle fatigue life in tight server chassis.
Absolutely. For liquid cooling manifolds and cold plates, we CNC wire-form clamps using 316L Stainless Steel with deep passivation. These clamps provide strong tension to prevent leaks and perfectly resist long-term corrosion from various glycol or fluorinated coolants.
This is the biggest advantage of our “One-Stop Manufacturing.” We have our own precision stamping and welding workshops. We can stamp the base plate, coil the compression spring, and assemble them using automated laser/spot welding or riveting. You receive a finished bracket ready to mount on the motherboard, drastically reducing your supply chain costs.