Precision Hardware & Component Solutions for AI Infrastructure
We solve extreme thermal and high-density packaging challenges for the AI era. As a trusted custom hardware manufacturer, we provide integrated wire forming, metal stamping, custom springs, and precision welding for AI servers and data centers.
Industry Overview
Driven by LLMs and generative AI, GPU power consumption now exceeds 1000W. This creates extreme thermal and mechanical challenges in dense systems. Engineers must manage intense heat, ensure cooling reliability, and prevent tolerance errors from multi-vendor parts. Hershey Spring specializes in the micro-mechanics of AI hardware. We deliver integrated sub-assemblies through our in-house capabilities: custom stamping, wire forming, spring coiling, and precision welding. Our parts are built for high creep resistance, precise fit, and 24/7 stability to eliminate server throttling and downtime. For GPU thermal management and high-speed optical modules (800G / 1.6T), we provide fully integrated solutions. This includes welded spring-loaded assemblies with zero downforce loss over a 5-to-10 year lifecycle. We also manufacture conductive micro-springs (canted coil or toroidal) that enable 360° EMI shielding and stable RF grounding in ultra-compact spaces.
Solutions & Customization Capabilities in AI
HERSHEY combines AI-driven technologies with precision spring manufacturing to deliver smarter, faster, and more reliable solutions. From intelligent design optimization to predictive performance analysis and automated production, our integrated approach enhances efficiency, ensures consistent quality, and accelerates development for demanding applications.
Industry-Grade Materials
- High Conductivity & EMI Shielding
Beryllium Copper (C17200): The ideal material for EMI/RFI shielding fingers in high-density server chassis, offering excellent conductivity and superior elasticity.
- High-Temperature & Creep Resistance
High-Yield Stainless Steel (301/304): Perfect for GPU heat sink mounting brackets. It maintains stable clamping force under continuous 80-100°C operation and prevents stress relaxation.
- Corrosion Resistance for Liquid Cooling
316L Stainless Steel: Engineered for pipe clamps and sealing springs in liquid-cooled AI servers, providing maximum resistance to coolant corrosion.
Mechanical/Functional Customization Options
- GPU Heat Sink Bracket Assemblies
One-stop solutions combining stamped bases, compression springs, and riveted or welded studs. Delivered ready for direct heat sink mounting.
- EMI/RFI Grounding Contacts
Custom-designed 3D grounding contacts for effective electromagnetic shielding in server drawers, HDD trays, and cabinet enclosures.
- Blind-Mate Guide Clips
Designed for high-density blade servers to ensure smooth module insertion, removal, and secure mechanical locking.
Durability & Reliability Enhancements
- Hot Pre-setting
Eliminates initial relaxation of spring-loaded brackets. This ensures constant downforce on chips over a 5-to-10 year lifecycle, preventing thermal throttling.
- NDT & 100% Inspection
Using CCD-based automated inspection, we verify that all contact parts are free of deformation and burrs to protect sensitive AI chip packages.
Industry-Focused Processes
- Ultra-Cleanliness Control
Dust-Free Ultrasonic Cleaning: Thoroughly removes machining oils and micro-debris. This prevents conductive particles from causing short circuits on sensitive motherboards.
- Precision Stamping & Forming
Using high-speed progressive dies, we manufacture ultra-thin parts down to 0.05mm thickness with strict tolerances—ideal for 1U/2U servers.
Qualification Certification Obtained
FAQ
Absolutely not. We know “stress relaxation” causes poor heat sink contact and chip overheating. We use high-yield materials (like full-hard SUS301) combined with Hot Pre-setting. This locks the material lattice, ensuring zero downforce attenuation even when operating continuously at 100°C+.
Yes, this is our core strength. Our precision stamping workshop specializes in Beryllium Copper grounding and shielding fingers. We can stamp materials down to 0.05mm thick. Combined with vacuum heat treatment and selective gold plating, we provide excellent conductivity and high mating-cycle fatigue life in tight server chassis.
Absolutely. For liquid cooling manifolds and cold plates, we CNC wire-form clamps using 316L Stainless Steel with deep passivation. These clamps provide strong tension to prevent leaks and perfectly resist long-term corrosion from various glycol or fluorinated coolants.
This is the biggest advantage of our “One-Stop Manufacturing.” We have our own precision stamping and welding workshops. We can stamp the base plate, coil the compression spring, and assemble them using automated laser/spot welding or riveting. You receive a finished bracket ready to mount on the motherboard, drastically reducing your supply chain costs.